CIO OPINION expenses ( OPEX ) due to the need for service and maintenance leads to rising costs , particularly at the extreme edge . The logistics and expenses of servicing remote sites drive up OPEX , making it a pressing concern for telco operators .
Liquid cooling as a solution
One promising avenue to address these challenges is liquid cooling . Cooling is a vital aspect of data centre operations , consuming approximately 40 % of the total electricity used . Liquid cooling is rapidly becoming the solution of choice to efficiently and cost-effectively accommodate today ’ s compute requirements . However , not all liquid cooling solutions are the same .
Direct-to-chip appears to offer the highest cooling performance at chip levels , but because it still requires air cooling , it adds inefficiencies at the system level . It is a nice interim solution to cool the hottest chips , but it does not address the longer-term goals of sustainability , serviceability and scalability .
Meanwhile , tank immersion offers a more sustainable option at the system level but requires a complete rethink of data centre design . This works counter to the goals of density , scalability , and most importantly , serviceability .
Facility and structural requirements mean brownfield data centre space is essentially eliminated as an option for both of those solutions , not to mention special training is required to service the equipment .
Precision Liquid Cooling combines the best of both technologies by removing nearly 100 % of the heat generated by the electronic components of a server and reducing energy use by up to 40 % and water consumption by up to 100 %. It does this by using a small amount of dielectric coolant to precisely target and remove heat from the hottest components of the server , ensuring maximum efficiency and reliability .
This eliminates the need for traditional air-cooling systems and allows for greater flexibility in designing
The major challenges confronting telco operators can be distilled into three fundamental aspects : power constraints , increased density and rising costs .
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